New
Arrivals/Restock
goot SF-C7008 Silverless Lead Free Solder, Φ0.03 inch (0.8 mm), For Precision Printed Circuit Boards, Tin Remain/0.7% Copper/0.05% Nickel/0.05% Germanium/Less 0.01% Germanium, 2.4 oz (70 g), No Bobbin
4.3 (120 items)
Limited Time SaleUntil the end
20
54
44
$20.04 cheaper than the new price!!
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New $33.40
Product details
| Management number | 209981921 | Release Date | 2026/04/02 | List Price | $13.36 | Model Number | 209981921 | ||
|---|---|---|---|---|---|---|---|---|---|
| Category | |||||||||
Non-toxic Lead Environmentally Friendly Lead Free Solder Silver Less 2.5 oz (70 g) for Substrate Diameter Φ0.8
- Eco-friendly non-bobbin paper packaging
- Composition: Tin residue: Copper 0.7%, Nickel 0.05%, Germanium 0.01% or less
- Melting Point: 227°C
- Wire diameter: 0.03 in (0.8 mm)
- Solder Roll: Approx. 2.5 oz (70 g), Approx. 16.4
| Brand Name | goot |
|---|---|
| Style Name | Φ0.8mm |
| Item Weight | 70 Grams |
| Manufacturer | 太洋電機産業(goot) |
| Model Number | ＳＦ－Ｃ７００８ |
| Power Source | No |
| Item Type Name | Solder |
| Heating Element | Silver |
| Number of Items | 1 |
| Additional Features | Achieves an even surface luster with less drag nesting, Excellent wetness to form beautiful fillets, Made in Japan |
| Included Components | No |
| Manufacturer Part Number | ＳＦ－Ｃ７００８ |
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