New
Arrivals/Restock
Silicon Wafer Back Grinding Process by Wafer World Inc.
4.3 (74 items)
Limited Time SaleUntil the end
05
27
27
$54.00 cheaper than the new price!!
Free shipping for purchases over $99 ( Details )
Free cash-on-delivery fees for purchases over $99
Free cash-on-delivery fees for purchases over $99
See all stores
Please note that the sales price and tax displayed may differ between online and in-store. Also, the product may be out of stock in-store.
New $90.00
Product details
| Management number | 211141845 | Release Date | 2026/04/04 | List Price | $36.00 | Model Number | 211141845 | ||
|---|---|---|---|---|---|---|---|---|---|
| Category | |||||||||
The process of thinning or back grinding silicon wafers from the rear involves eliminating material to enhance efficiency and decrease costs in semiconductor manufacturing.
| Color | Gray |
|---|---|
| Brand Name | Wafer World Inc. |
| Manufacturer | Wafer World Inc. |
| Power Source | manual |
| Material Type | Silicon |
| Specific Uses For Product | Semiconductor manufacturing |
| Recommended Uses For Product | grinding spices and herbs, milling grains for flour, making nut butters and pastes |
Bestseller ranking
Grinding Compounds
Correction of product information
If you notice any omissions or errors in the product information on this page, please use the correction request form below.
Correction Request Form